Features
- Dual Socket BR (LGA-7529)
Support Intel® Xeon® 6900 Series processors - 24 DIMMs up to 8TB 3DS ECC DDR5-6400: RDIMM
- Support SAS/SATA/NVMe drives, support hot-swap
- Up to 10 Expansion slots, support PCIe 5.0 x16
- 2 OCP 3.0 Slots
- AST2600, support IPMI 2.0
- Based OCSP2.0, Decoupling of system modules
Special Design

Front view
➊ Power Button
➋ UID Button
➌ 2x USB2.0 Type A
➍ VGA

Rear view
➊ OCP3.0-L
➋ UART(Type C port)
➌ 2x USB3.0 Type A
➍ RJ45(NC-SI)
➎ UID
➏ VGA
➐ OCP3.0-R
Specifications
System Model | B2612-G6AP |
---|---|
Processor | Supports Intel® Xeon 6900-Series Processors Supports up to 500W TDP CPUs |
Chipset | System on Chip |
Memory | Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM
or 3TB 8800MT/s DDR5 MRDIMM |
Storage | Front hot-swap: Support 12 hot-swap 3.5/2.5 SAS/SATA hard drives
Rear hot-swap: Support 2 hot-swap 3.5/2.5 SAS/SATA hard drives or 4 hot-swap 2.5 SAS/SATA/NVMe Internal M.2: 2 x M.2 (Up to 2280) SSD |
Raid | Support to VROC,RAID 0, 1, 5, 6, 10, 50, and 60,Support Cache SuperCapacitor |
PCIe Expansion | UP to 10 x PCIe 5.0 slots (Offer interface expansions of SFF-TA-1033 and SFF-TA-1016 ) (Air Cooled); UP to 6 x PCIe 5.0 slots (Offer interface expansions of SFF-TA-1033 and SFF-TA-1016 ) (Liquid Cooled); OCP: 2 OCP 3.0 Slots |
GPU Card | Up to 4 double-width or 10 single-width GPUs |
Network | 1x 1GbE (RJ45) onboard, Support NCSI function |
IO Ports | Front: 2x USB2.0, 1x VGA(option)
Rear: 2x USB3.0, 1x VGA,1x 1GbE (RJ45) ,1x USB TypeC(UART) Internal: 1 x TPM header |
Fan | Standard 4 hot-swap N+1 redundant fans, supporting 6038/6056 specifications |
Power Supply | Supports AC 220V 800W, 1300W, 1600W, 2000W, 2200W, 2600W redundant power supplies |
BMC | DC-SCM 2.0 module, Based Aspeed AST2600,support IPMI2.0/Redfish |
Server Size | 3.45 (H) x 17.6 (W) x 31.5 (D)(87mm x 447.4mm x 799mm) |
Operating Environment |
Operation Temperature.: 10° C ~ 35° C ,Non-Operation Temperature:-40° C~70° C
In/Non-operating Humidity: 20%~90%,(non-condensing) |