Additional files

ManualStructureSpec
Mid Tower YY-5709
 

Overview

A quality chassis to meet Intel thermal requirement. The reusable metal cover with excellent EMI shielding for all exposed drive bays. The quick assembly fastened kits to shorten the assembly time.

 

Special Design

Thermal Solution

  • The TAC 2.0 Guide specifies 110mm x 150mm vent width an effective open area of 60%
  • TAC 2.0 does not require a duct or any new additional system fans

Specifications

SPECIFICATIONS
Module YY-5709
Case dimension 190mm W x 438mm D x 420mm H
Motherboard configuration ATX
Drive configuration 4 - 5.25"
2 - 3.5" For FDD or Card Reader
4 - 3.5" For HDD
Optional system cooling fans 1*8cm or 9cm or 12cm fan for rear-mounted
1*12cm for front-mounted
Expansion slots and ports Standard PCI 7 slots
Front panel control Power switch, Power LED, HDD LED
USB 2.0 x 2 (or USB 3.1 gen 1 x 2, USB 3.1 gen 1 x 2 + USB 2.0 x 2, USB 2.0 x 4) + HD Audio
Multi-function Card reader (Optional)
Materials Recyclable materials
94HB ABS, t0.6 SECC steel
Net Weight 5.5kgs / 12.1lbs without PSU
Color Black
Power Supply ATX12V 300W-550W
Options Cooling fan, USB/Audio/IEEE1394, Multi-function Card reader,
TAC 2.0 Air Guide solution
Packing /Shipping 480pcs/20'container
976pcs/40' container
1100pcs/40HQ container