Meets lower ambient temperature guideline of 38°C for
Prescott® LGA775® & Next Generation
- Thermally Advantaged Chassis
- Could be vertical stand up as a tower or horizontal as a desktop.
- Snap-in front panel, screw less and wire-free
- Easy for system assembly and time saving
- Supply the best ventilation
- Front access USB2.0+Audio (optional)
- Test Report :
SGS Theraml Report
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SPECIFICATIONS
ModelYY-A110YY-A210
Case dimension
136mm W x 340mm D x 329mm H
( 5.3"W x 13.3"D x 12.9"H )
136mm W x 370mm D x 329mm H
( 5.3"W x 14.5"D x 12.9"H )
Motherboard configurationMicro ATX
Drive configuration
1 - 5.25" CDROM
1 - 3.5" FDD
1 - 3.5"(1") HDD
1 - 5.25" CDROM
1 - 3.5" FDD
1 - 3.5"(1") HDD
1 - 3.5"(1") HDD Option
Optional system cooling fans 1 x 6cm fan ( rear-mounted ) 2 x 6cm fan ( rear-mounted )
Expansion slots and ports4 slots
Front panel control
Power switch, Power LED, HDD LED
Dual USB (Optional)
Materials
Recyclable materials
Flame retardant plastic parts and front bezel(HB)
Steel chassis
Meets the requirements of RoHs & WEEE
EmissionsDesigned to meet FCC class B-47 CFR part15/IEC/CISPR 22:1993
Net Weight4.6kgs / 10.lbs
ColorStandard color : Cool Gray / Black / Silver
Power Supply (Option)
SFX 12V 200W-300W Power Supply
UL, CSA, TÜV, CE approved, Doc compliance
Options
1 x 6cm cooling fans (ball bearing)
Dual USB+Audio
2 x 6cm cooling fans (ball bearing)
USB, Intrusion switch, Air Guide,
Cleanable filter function
Packing /Shipping
1.12cuft/carton
935pcs/20'container
1950pcs/40' container
2160pcs/40HQ container
1.2cuft/carton
870pcs/20'container
1800pcs/40' container
2016pcs/40HQ container
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