Intel ® Core™ i7 Processor (Bloomfield)
TAC 2.0 Thermally Advantaged Chassis
- Thermally Advantaged Chassis
- Front access USB2.0+Audio+IEEE1394 (Optional)
- Easy for system assembly and time saving
- Low acoustic level
- Thumbscrews on side panel for tool-less access to inside components
- Sliding rail for CDROM drive installation
- Snap-in front panel, screw-less and wire-free
- Excellent ventilation & EMI containment
- Reusable metal cover with excellent EMI shielding for all exposed drive bays,
allows systems' re-structuring - Built-in standoffs, saving assembly time
SPECIFICATIONS
ModelYY-5801
Case dimension 190mm W x 438mm D x 420mm H
Motherboard configurationATX
Drive configuration
4 - 5.25"
1 - 3.5"
4 - 3.5"
Optional system cooling fans
1*8cm or 9cm or 12cm fan for rear-mounted
1*12cm for front-mounted
Expansion slots and portsStandard PCI 7 slots
Front panel control
Power switch, Power LED, HDD LED, support 2.5" or 3.5"SATA HDD
USB/Audio/IEEE1394 (Optional)
Multi-function Card reader (Optional)
Materials
Recyclable materials
94HB ABS, t0.6 SECC steel
Net Weight5.5kgs / 12.1lbs without PSU
ColorBlack
Power SupplyATX12V 300W-550W
Options
Cooling fan, USB/Audio/IEEE1394, Multi-function Card reader,
TAC 2.0 Air Guide solution
Packing /Shipping
400pcs/20'container
920pcs/40' container
1030pcs/40HQ container