Meet lower ambient temperature guideline of 38°C for
For Prescott® LGA775® & Next Generation
- Thermally Advantaged Chassis
- Screw-less CDROM, HDD & Add-on cards assembly
- Screw-less lockable side panel
- U-seam designed for EMI solution
- High performance AGP card holder
- Front access USB2.0 / Audio / IEEE1394
- Low acoustic level
- Reviews :
PimpRig.com Club Overclocker.com
A True Review pcunleash
3DVelocity.com Tom's Hardware Guide
SilentPCReview.com - Test Report :
Thermal Report for Nacona solution
Thermal Report for Prescott 3.2GHz
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SPECIFICATIONS
ModelYY-5603 (Mars)
Case dimension
200mm W x 455mm D x 430mm H
( 7.9"W x 17.9"D x 16.9"H )
Motherboard configurationATX, Micro ATX
Drive configuration
Up to 10 drive bays :
4 - 5.25" exposed
1 - 3.5" exposed
5 - 3.5"(1") hidden
Optional system cooling fans 2 x 12cm fans for front-mounted and rear-mounted
Expansion slots and ports7 slots
SpeakerBuzzer
Front panel control
Power switch, Reset switch, Power LED, HDD LED
USB 2.0,Audio, IEEE1394
Materials
Recyclable materials; Steel chassis
Flame retardant plastic parts and front bezel(HB)
Meets the requirements of RoHs & WEEE
EmissionsDesigned to meet FCC class B-47 CFR part15/IEC/CISPR 22:1993
Net Weight7.5kgs without PSU, 8.9kgs with PSU
ColorBlack
Power SupplyATX12V 2.0 300W~460W
Options
2 x 12cm fans (front & rear mounted)
Intrusion switch , Air Guide
Packing /Shipping
2.98cuft/carton
352pcs/20'container
736pcs/40' container
796pcs/40HQ container