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ATX Mid Tower

Intel® Core™ i7 Processor (Bloomfield)

TAC 2.0 Thermally Advantaged Chassis

• Thermally-Advantaged Chassis
• Time saving system assembly
• None screw side cover
• 5 1/4" Snap-On rail mounting
• Wire-free snap-in front panel
• Built-in standoffs
• Quick assembly
• Front access USB/Audio/IEEE1394 (optional)
• ATX 12V compliant
• Excellent ventilation & EMI
• Low acoustic dB
• Best Thermal Solution-10 mm pitch for each HDD
• Optional Air Guide for Thermal Solution
• Test Report :
  EMI Test Report
  Thermal Test Report
  Intel Prescott 3.8GHz-Cache LGA 775
  Thermal Test Report
  55xx Thermally Advantaged Chassis
  PASS Intel® Pentium®4 Processor on 90 nm process in the 775-land package
  with PRB = 1 Chassis Thermal / Mechanical Compliance test

:: Optional For 55xx Series ::
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SPECIFICATIONS

ModelYY-5510

Case dimension
  180mm W x 432mm D x 420mm H
( 7.1"W x 17"D x 16.5"H )

Motherboard configurationATX, Micro ATX

Drive configuration
 
 
   Up to 6 drive bays :
3 - 5.25" exposed (The 3rd 5.25" Bay may not afford 5.25" device when m/b size more than 7.6"X12")
2 - 3.5" exposed
1 - 3.5"(1") hidden

Expansion slots and ports7 slots

Front panel control
  Power switch, Power LED, HDD LED
USB/Audio/IEEE1394 (optional)

Materials
 
 
  Recyclable materials
Flame retardant plastic parts and front bezel (HB)
Steel chassis
Meets the requirements of RoHs & WEEE

EmissionsDesigned to meet FCC class B-47 CFR part15/IEC/CISPR 22:1993

Net Weight6.6kgs / 14.5lbs without PSU

ColorBlack + Silver

Power SupplyATX 12V 300W~450W

Options
 
  2 x 9cm fans for front-mounted and rear-mounted
USB/Audio/IEEE1394
Air guide solution, Intrusion switch

Packing /Shipping
 
 
  2.1cuft/carton
500pcs/20'container
1056pcs/40' container
1150pcs/40HQ container