|
|
Thermally-Advantaged
Chassis |
|
|
Low
acoustic level |
|
|
Snap-in
front panel, screw-less and wire-free |
|
|
Easy
for system assembly and time saving |
|
|
Front
access USB2.0 & Audio, IEEE1394 optional |
|
|
Optional
Air Guide for Thermal Solution |
|
|
Excellent
ventilation & EMI containment |
|
|
Front
access top cover, easy for system's maintenance |
|
|
Reusable
metal cover for all exposed drive bays, allows systems'
re-structuring and excellent EMI shielding |
|
|
Built-in
standoffs, saving assembly time |
|
|
Pass
Prescott® CPU |
|
|
Test
Report : |
| |
Thermal
Test Report |
| |
Intel
Prescott 3.8GHz-Cache LGA 775 |
| |
Thermal
Test Report
54xx Thermally Advantaged Chassis
PASS Intel® Pentium®4 Processor on 90 nm process
in the 775-land package with PRB = 1 Chassis Thermal /
Mechanical Compliance test |
