Gaming Tower
Meets lower ambient temperature guideline of 38°C for
Prescott® LGA775® & Next Generation
- Thermally Advantaged Chassis
- Control panel on the top of front panel for reaching it easy
- Screw-less CDROM, HDD & Add-on cards assembly
- Screw-less lockable side panel
- CAG1.1 for thermal solution
- U-Seam designed for EMI solution
- High performance for AGP card holder
- Front access USB2.0+Audio+IEEE1394
- Low acoustic level
